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  preliminary i ntegrated c ircuits d ivision preliminary ds-CPC3909-r00d 1 CPC3909 400v n-channel depletion-mode fet part number description CPC3909ctr sot-89: tape and reel (1000/reel) CPC3909ztr sot-223: tape and reel (1000/reel) applications features description ordering information package pinout: ? led drive circuits ? telecommunications ? normally on switches ? ignition modules ? converters ? security ? power supplies ? regulators ? 400v drain-to-source voltage ? depletion mode device offers low r ds(on) at cold temperatures ? low on-resistance: 4.5 ? (typical) @ 25c ? low v gs(off) voltage ? high input impedance ? low input and output leakage ? small package size sot-89 and sot-223 ? pc card (pcmcia) compatible ? pcb space and cost savings the CPC3909 is an n-channel, depletion mode field effect transistor (fet) that is available in an sot-223 package (CPC3909z) and an sot-89 package (CPC3909c). both utilize ixys integrated circuits division?s proprietary vertical dmos process that realizes world class, high voltage mosfet performance in an economical silicon gate process. the vertical dmos process yields a highly reliable device, particularly for use in difficult application environments such as telecommunications, security, and power supplies. CPC3909z and the CPC3909c have a typical on-resistance of 4.5 ? and a drain-to-source voltage of 400v. as with all mos devices, the fet structure prevents thermal runaway and thermally induced secondary breakdown. pin number name 1gate 2 drain 3 source 4 drain parameter rating units drain-to-source voltage - v (br)dsx 400 v max on-resistance - r ds(on) 6 ? max power sot-89 package 1.1 w sot-223 package 2.5 circuit symbol d g d s 4 123 d s g
preliminary i ntegrated c ircuits d ivision preliminary 2 r00d CPC3909 electrical characteristics @25 o c (unless otherwise specified) absolute maximum ratings @ 25oc thermal resistance device parameter symbol conditions min typ max units sot-89 (CPC3909c) junction to case r ? jc --- 50 oc/w junction to ambient r ? ja 90 sot-223 (CPC3909z) junction to case r ? jc --- 14 junction to ambient r ? ja 55 parameter ratings units drain-to-source voltage (v (br)dsx ) 400 v gate-to-source voltage (v gs )15v total package dissipation 1 sot-89 1.1 w sot-223 2.5 operational temperature -40 to +110 o c storage temperature -40 to +125 o c 1 mounted on 1"x1" fr4 board. absolute maximum ratings are stress ratings. stresses in excess of these ratings can cause permanent damage to the device. functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. typical values are characteristic of the device at +25c, and are the result of engineering evaluations. they are provided for information purposes only, and are not part of the manufacturing testing requirements. parameter symbol conditions min typ max units gate-to-source off voltage v gs(off) i d =1 ? a, v ds =5v -1.4 - -3.1 v drain-to-source leakage current i ds(off) v gs = -5.5v, v ds =240v - - 20 na v gs = -5.5v, v ds =400v - - 1 ? a drain current i d v gs = 0v, v ds =5v 300 - - ma on-resistance r ds(on) v gs = 0v, i ds =300ma - 4.5 6 ? gate leakage current i gss v gs =15v - - 100 na gate capacitance c iss v ds = v gs =0v - - 275 pf
preliminary i ntegrated c ircuits d ivision CPC3909 preliminary 3 r00d performance data @ 25oc (unless otherwise noted)* *the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in t he written speci? cations, please contact our application department. v gs (v) -2.5 -2.0 -1.5 -1.0 -0.5 0.0 i d (a) 0.0 0.2 0.4 0.6 0.8 1.0 instantaneous transfer characteristics (v ds =10v) -40oc 25oc 125oc temperature (oc) -50 -25 0 25 50 75 100 125 150 threshold voltage (v) -3.5 -3.0 -2.5 -2.0 -1.5 -1.0 -0.5 0.0 threshold voltage (i ds =2 p a) i d (ma) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 g m (ms) 0.00 0.25 0.50 0.75 1.00 1.25 1.50 transconductance vs. drain current (v gs =10v) -40oc 25oc 125oc voltage (v) 0.1 1 10 100 1000 current (a) 0.001 0.01 0.1 1 forward safe operating bias sot-89 package voltage (v) 0.1 1 10 100 1000 current (a) 0.001 0.01 0.1 1 forward safe operating bias sot-223 package v ds (v) 012345 i d (a) 0.0 0.2 0.4 0.6 0.8 1.0 output characteristics v gs =-0.5v v gs =0v v gs =-1v v gs =-1.5v v gs =-2v temperature (oc) 0 20 40 60 80 100 120 140 power dissipation (w) power dissipation vs. ambient temperature sot-89 package 0.0 0.2 0.4 0.6 0.8 1.0 1.2 temperature (oc) 0 20 40 60 80 100 120 140 power dissipation (w) 0.0 0.5 1.0 1.5 2.0 power dissipation vs. ambient temperature sot-223 package
preliminary i ntegrated c ircuits d ivision preliminary 4 r00d CPC3909 performance data @ 25oc (unless otherwise noted)* *the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in t he written speci? cations, please contact our application department. temperature (oc) -50 -25 0 25 50 75 100 125 150 blocking voltage (v p ) 460 470 480 490 500 510 520 blocking voltage vs. temperature (i l =5 p a) temperature (oc) -50 -25 0 25 50 75 100 125 150 leakage current ( p a) 0 0.2 0.4 0.6 0.8 1.0 1.2 leakage current vs. temperature (v gs =5v, v ds =400v) v ds (v) 0 5 10 15 20 25 30 35 capacitance (pf) 0 50 100 150 200 250 300 capacitance vs. drain-source voltage (v gs =-3.5v) ciss coss crss i d (ma) 0.0 0.2 0.4 0.6 0.8 1.0 on resistance ( : ) 0 2 4 6 8 10 on-resistance vs. drain current (v gs =0v) 125oc 25oc -40oc temperature (oc) -50 -25 0 25 50 75 100 125 150 on-resistance ( : ) 2 3 4 5 6 7 8 9 10 on-resistance vs. temperature (i l =300ma, v gs =0v)
preliminary i ntegrated c ircuits d ivision CPC3909 preliminary 5 r00d manufacturing information moisture sensitivity all plastic encapsulated semiconductor packages are susceptible to moisture ingression. ixys integrated circuits division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, ipc/jedec j-std-020 , in force at the time of product evaluation. we test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. this product carries a moisture sensitivity level (msl) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard ipc/jedec j-std-033 . device moisture sensitivity level (msl) rating CPC3909c / CPC3909z msl 1 esd sensitivity this product is esd sensitive , and should be handled according to the industry standard jesd-625 . soldering profile this product has a maximum body temperature and time rating as shown below. all other guidelines of j-std-020 must be observed. device maximum temperature x time maximum re ow cycles CPC3909c / CPC3909z 260oc for 30 seconds 3 board wash ixys integrated circuits division recommends the use of no-clean flux formulations. however, board washing to remove flux residue is acceptable, and the use of a short drying bake may be necessary. chlorine-based or fluorine-based solvents or fluxes should not be used. cleaning methods that employ ultrasonic energy should not be used.
preliminary i ntegrated c ircuits d ivision preliminary 6 r00d CPC3909 dimensions mm min / mm max (inches min / inches max) 6.705 / 7.290 (0.264 / 0.287) 0.229 / 0.330 (0.009 / 0.013) 0.914 min (0.036 min) 1.90 (0.075) 1.90 (0.075) 6.10 (0.24) 2.286 (0.090) 0.90 (0.035) 3.20 (0.126) 6.30 / 6.71 (0.248 / 0.264) 2.286 (0.090) 3.30 / 3.71 (0.130 / 0.146) 2.90 / 3.10 (0.114 / 0.122) 0.610 / 0.787 (0.024 / 0.031) 0.020 / 0.102 (0.0008 / 0.004) 0.864 / 1.067 (0.034 / 0.042) 4.597 (0.181) 1.549 / 1.803 (0.061 / 0.071) 1.499 / 1.981 (0.059 / 0.078) pcb land pattern pin 1 CPC3909z mechanical dimensions CPC3909c dimensions mm min / mm max (inches min / inches max) 2.286 / 2.591 (0.090 / 0.102) 3.937 / 4.242 (0.155 / 0.167) 1.397 / 1.600 (0.055 / 0.063) 0.356 / 0.432 (0.014 / 0.017) 1.626 / 1.829 (0.064 / 0.072) r 0.254 (r 0.010) 0.889 / 1.194 (0.035 / 0.047) 0.356 / 0.483 (0.014 / 0.019) 0.432 / 0.559 (0.017 / 0.022) 4.394 / 4.597 (0.173 / 0.181) 1.422 / 1.575 (0.056 / 0.062) 2.921 / 3.073 (0.115 / 0.121) 0.60 (0.024) typ 3 1.40 (0.055) 2.45 (0.096) 1.90 (0.075) 1.90 (0.074) 5.00 (0.197) 50o pcb land pattern pin 1 1.118 / 1.270 (0.044 / 0.050) 50o 0.432 / 0.508 (0.017 / 0.020) 0.864 / 1.016 (0.034 / 0.040) 2.845 / 2.997 (0.112 / 0.118) 45o
ixys integrated circuits division makes no representations or warranties with respect to the accuracy or completeness of the co ntents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. neither circuit patent licenses nor indemnity a re expressed or implied. except as set forth in ixys integrated circuits division?s standard terms and conditions of sale, ixys integrated circuits division assumes no liability whatsoever, a nd disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infri ngement of any intellectual property right. the products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of ixys integrated circuits division?s product may resul t in direct physical harm, injury, or death to a person or severe property or environmental damage. ixys integrated circuits division reserves the right to discontinue or make changes to its p roducts at any time without notice. preliminary i ntegrated c ircuits d ivision specification: ds-CPC3909-r00d ?copyright 2015, ixys integrated circuits division all rights reserved. printed in usa. 4/10/2015 for additional information please visit our website at: www.ixysic.com CPC3909 7 CPC3909ztr tape & reel mechanical dimensions CPC3909ctr tape & reel dimensions mm (inches) embossment embossed carrier 177.8 dia (7.00 dia) top cover tape thickness 0.102 max (0.004 max) w=12.00 0.3 (0.472 0.012) b 0 =4.60 0.1 (0.181 0.004) a 0 =4.80 0.1 (0.189 0.004) p=8.00 0.1 (0.315 0.004) k 0 =1.80 0.1 (0.071 0.004) 2.00 0.05 (0.079 0.002) 4.00 0.1 (0.157 0.004) 1.75 0.1 (0.069 0.004) 5.50 0.05 (0.217 0.002) dimensions mm (inches) embossment embossed carrier 177.8 dia (7.00 dia) top cover tape thickness 0.102 max (0.004 max) w=12.08 0.2 (0.476 0.008) b 0 =7.42 0.1 (0.292 0.004) a 0 =6.83 0.1 (0.269 0.004) p=8.03 0.1 (0.316 0.004) k 0 =1.88 0.1 (0.074 0.004) 2.00 0.05 (0.079 0.002) 4.00 0.1 (0.157 0.004) 1.75 0.1 (0.069 0.004) 5.50 0.05 (0.217 0.002)


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